Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483233 | Split ball grid array pad for multi-chip modules | Anson J. Call, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble | 2019-11-19 |
EC
Erwin B. Cohen
Overall (2019): #475,535 of 560,194Top 85%
1
Patents 2019