Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483233 | Split ball grid array pad for multi-chip modules | Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble | 2019-11-19 |
| 10423752 | Semiconductor package metal shadowing checks | Francesco Preda, Paul R. Walling | 2019-09-24 |
| 10276534 | Reduction of solder interconnect stress | Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga | 2019-04-30 |
| 10276535 | Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress | Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga | 2019-04-30 |