Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276534 | Reduction of solder interconnect stress | Anson J. Call, David J. Russell, Krishna R. Tunga | 2019-04-30 |
| 10276535 | Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress | Anson J. Call, David J. Russell, Krishna R. Tunga | 2019-04-30 |