Issued Patents 2019
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515929 | Carrier and integrated memory | Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-12-24 |
| 10458033 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2019-10-29 |
| 10450667 | System for treating solution for use in electroplating application and method for treating solution for use in electroplating application | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2019-10-22 |
| 10431563 | Carrier and integrated memory | Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-10-01 |
| 10409006 | Photonics chip | Jeffrey P. Gambino, Wolfgang Sauter, Christopher D. Muzzy, Robert K. Leidy | 2019-09-10 |
| 10392720 | Prevent and remove organics from reservoir wells | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2019-08-27 |
| 10388418 | Wearable articles for repelling decay products generated from radon | Michael S. Gordon | 2019-08-20 |
| 10325830 | Multipart lid for a semiconductor package with multiple components | Steven P. Ostrander, Krishna R. Tunga | 2019-06-18 |
| 10287698 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2019-05-14 |
| 10287702 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2019-05-14 |
| 10290599 | Conductive pillar shaped for solder confinement | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2019-05-14 |
| 10276275 | Reducing environmental radon | Michael S. Gordon | 2019-04-30 |
| 10249586 | Mixed UBM and mixed pitch on a single die | Christopher D. Muzzy | 2019-04-02 |
| 10236089 | Reducing environmental radon | Michael S. Gordon | 2019-03-19 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224269 | Element place on laminates | Brian M. Erwin, Brian W. Quinlan | 2019-03-05 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2019-02-12 |
| 10192839 | Conductive pillar shaped for solder confinement | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2019-01-29 |
| 10170446 | Structures and methods to enable a full intermetallic interconnect | Christopher D. Muzzy, Wolfgang Sauter | 2019-01-01 |
| 10167568 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2019-01-01 |