Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10409006 | Photonics chip | Jeffrey P. Gambino, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy | 2019-09-10 |
| 10290599 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2019-05-14 |
| 10249586 | Mixed UBM and mixed pitch on a single die | Charles L. Arvin | 2019-04-02 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter | 2019-02-12 |
| 10192839 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2019-01-29 |
| 10170446 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Wolfgang Sauter | 2019-01-01 |