Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476227 | Dual bond pad structure for photonics | Jeffrey P. Gambino, Robert K. Leidy, Jeffrey C. Maling | 2019-11-12 |
| 10340241 | Chip-on-chip structure and methods of manufacture | Jay F. Leonard, David J. West, Charles H. Wilson | 2019-07-02 |
| 10304763 | Producing wafer level packaging using leadframe strip and related device | Sudeep Mandal, Kibby B. Horsford | 2019-05-28 |
| 10249590 | Stacked dies using one or more interposers | Sudeep Mandal, Sebastian T. Ventrone | 2019-04-02 |
| 10170224 | Low temperature fabrication of lateral thin film varistor | Jeffrey P. Gambino, Sudeep Mandal | 2019-01-01 |