Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485111 | Via and skip via structures | Shao Beng Law, Errol Todd Ryan, James Jay McMahon, Ryan Smith, Xunyuan Zhang | 2019-11-19 |
| 10475692 | Self aligned buried power rail | Guillaume Bouche, Lars Liebmann | 2019-11-12 |
| 10366919 | Fully aligned via in ground rule region | Xunyuan Zhang | 2019-07-30 |
| 10304833 | Method of forming complementary nano-sheet/wire transistor devices with same depth contacts | Puneet Harischandra Suvarna, Bipul C. Paul, Ruilong Xie, Bartlomiej Jan Pawlak, Lars Liebmann +2 more | 2019-05-28 |
| 10283372 | Interconnects formed by a metal replacement process | Sean Xuan Lin, Xunyuan Zhang, Mark V. Raymond, Errol Todd Ryan | 2019-05-07 |
| 10211100 | Methods of forming an air gap adjacent a gate of a transistor and a gate contact above the active region of the transistor | Ruilong Xie, Lars Liebmann, Nigel G. Cave, Andre P. Labonte, Guillaume Bouche +1 more | 2019-02-19 |
| 10199261 | Via and skip via structures | James Jay McMahon, Ryan Smith, Errol Todd Ryan, Xunyuan Zhang, Shao Beng Law | 2019-02-05 |
| 10177028 | Method for manufacturing fully aligned via structures having relaxed gapfills | Errol Todd Ryan | 2019-01-08 |