Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47630 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Ming He, Xunyuan Zhang | 2019-10-01 |
| 10395926 | Multiple patterning with mandrel cuts formed using a block mask | Minghao Tang, Yuping Ren, Shao Beng Law, Genevieve Beique, Xun XIANG +1 more | 2019-08-27 |
| 10283372 | Interconnects formed by a metal replacement process | Xunyuan Zhang, Mark V. Raymond, Errol Todd Ryan, Nicholas V. LiCausi | 2019-05-07 |
| 10181421 | Liner recess for fully aligned via | Errol Todd Ryan | 2019-01-15 |