Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47630 | Semiconductor device having a self-forming barrier layer at via bottom | Ming He, Xunyuan Zhang, Sean Xuan Lin | 2019-10-01 |
| 10262943 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2019-04-16 |