Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485111 | Via and skip via structures | Shao Beng Law, Nicholas V. LiCausi, Errol Todd Ryan, Ryan Smith, Xunyuan Zhang | 2019-11-19 |
| 10199261 | Via and skip via structures | Ryan Smith, Nicholas V. LiCausi, Errol Todd Ryan, Xunyuan Zhang, Shao Beng Law | 2019-02-05 |
| 10186509 | Method and system for a semiconductor device with integrated transient voltage suppression | Avinash Srikrishnan Kashyap, Peter Micah Sandvik, Ljubisa Dragoljub Stevanovic | 2019-01-22 |