Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403535 | Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system | Zheng John Ye, Jay D. Pinson, II, Hiroji Hanawa, Jianhua Zhou, Xing Lin +11 more | 2019-09-03 |
| 10325800 | High temperature electrostatic chucking with dielectric constant engineered in-situ charge trap materials | Prashant Kumar Kulshreshtha, Kwangduk Douglas Lee, Bok Hoen Kim, Zheng John Ye, Ganesh Balasubramanian +2 more | 2019-06-18 |