Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424487 | Atomic layer etching processes | Jungmin Ko, Tom Choi, Junghoon Kim, Mang-Mang Ling | 2019-09-24 |
| 10269571 | Methods for fabricating nanowire for semiconductor applications | Keith Tatseun Wong, Shiyu Sun, Nam Sung Kim, Srinivas D. Nemani, Ellie Yieh | 2019-04-23 |
| 10242908 | Airgap formation with damage-free copper | Jungmin Ko, Oliver Luere | 2019-03-26 |
| 10224224 | High pressure wafer processing systems and related methods | Qiwei Liang, Srinivas D. Nemani, Adib Khan, Venkata Ravishankar Kasibhotla, Sultan Malik +1 more | 2019-03-05 |
| 10177050 | Methods and apparatus for controlling substrate uniformity | S. M. Reza Sadjadi, Dmitry Lubomirsky, Hamid Noorbakhsh, John Zheng Ye, David H. Quach | 2019-01-08 |