Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510602 | Methods of producing self-aligned vias | Ying Zhang, Abhijit Basu Mallick, Yung-Chen Lin, Qingjun Zhou, Ho-yung David Hwang +1 more | 2019-12-17 |
| 10438849 | Microwave anneal to improve CVD metal gap-fill and throughput | Jie Zhou, Guannan Chen, Michael W. Stowell, Bencherki Mebarki, Mehul Naik +3 more | 2019-10-08 |
| 10388533 | Process integration method to tune resistivity of nickel silicide | Minrui Yu, Mehul Naik | 2019-08-20 |
| 10256144 | Process integration approach of selective tungsten via fill | Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik, Zhiyuan Wu +2 more | 2019-04-09 |
| 10170299 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | Mehul Naik, Yong Cao, Yana Cheng, Weifeng YE | 2019-01-01 |