Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Manabu Oie, Kaoru Maekawa, Cory Wajda, Gerrit J. Leusink, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10056328 | Ruthenium metal feature fill for interconnects | Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka, Takahiro Hakamata | 2018-08-21 |
| 10027332 | Referenceless clock and data recovery circuits | Jin Wang | 2018-07-17 |
| 10014213 | Selective bottom-up metal feature filling for interconnects | Kandabara Tapily, Robert D. Clark, Gerrit J. Leusink | 2018-07-03 |
| 9981742 | Autonomous navigation method and system, and map modeling method and system | Kai Ni, Yanke Wang, Liang Wang, Ji Tao | 2018-05-29 |