Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096548 | Method of manufacturing Cu wiring | Kenji Matsumoto, Peng Chang, Osamu Yokoyama, Takashi Sakuma, Hiroyuki Nagai | 2018-10-09 |
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Takahiro Hakamata | 2018-08-21 |
| 9932669 | Metal nanodot formation method, metal nanodot formation apparatus and semiconductor device manufacturing method | — | 2018-04-03 |