Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163699 | Cu wiring forming method and semiconductor device manufacturing method | Hiroyuki Nagai, Kenji Matsumoto | 2018-12-25 |
| 10096548 | Method of manufacturing Cu wiring | Kenji Matsumoto, Tadahiro Ishizaka, Osamu Yokoyama, Takashi Sakuma, Hiroyuki Nagai | 2018-10-09 |