Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Kaoru Maekawa, Cory Wajda, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10068764 | Selective metal oxide deposition using a self-assembled monolayer surface pretreatment | Kandabara Tapily, Cory Wajda, Hoyoung Kang | 2018-09-04 |
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Cory Wajda, Tadahiro Ishizaka, Takahiro Hakamata | 2018-08-21 |
| 10014213 | Selective bottom-up metal feature filling for interconnects | Kai-Hung Yu, Kandabara Tapily, Robert D. Clark | 2018-07-03 |
| 10008564 | Method of corner rounding and trimming of nanowires by microwave plasma | Kandabara Tapily, Ying Trickett, Chihiro TAMURA, Cory Wajda, Kaoru Maekawa | 2018-06-26 |