Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Kaoru Maekawa, Cory Wajda, Gerrit J. Leusink +2 more | 2018-12-18 |