Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Cory Wajda, Gerrit J. Leusink, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10008564 | Method of corner rounding and trimming of nanowires by microwave plasma | Kandabara Tapily, Ying Trickett, Chihiro TAMURA, Cory Wajda, Gerrit J. Leusink | 2018-06-26 |