Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2018-08-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2018-08-21 |