Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163557 | Helical plated through-hole package inductor | William J. Lambert, Mihir K. Roy, Mathew J. Manusharow | 2018-12-25 |
| 10123431 | Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material | — | 2018-11-06 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Robert Alan May, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 |