Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Ashok S. Prabhu | 2018-10-30 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |