Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128116 | Integrated direct dielectric and metal deposition | Bart J. van Schravendijk, David Charles Smith, Michal Danek, Patrick A. Van Cleemput, Ramesh Chandrasekharan | 2018-11-13 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2018-01-23 |