Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115629 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Eric G. Liniger, Sanjay C. Mehta +2 more | 2018-10-30 |
| 9974650 | Prosthetic heart valve | Diana Nguyen-Thien-Nhon, Timothy A. Geiser, Larry L. Wood, Dinesh L. Sirimanne, Tamir S. Levi +2 more | 2018-05-22 |
| 9974652 | Low profile transcatheter heart valve | Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon +3 more | 2018-05-22 |
| 9947581 | Method of forming a copper based interconnect structure | Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more | 2018-04-17 |
| 9934963 | Multilayer dielectric structures with graded composition for nano-scale semiconductor devices | Deepika Priyadarshini | 2018-04-03 |
| 9892961 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Eric G. Liniger, Sanjay C. Mehta +2 more | 2018-02-13 |
| 9859212 | Multi-level air gap formation in dual-damascene structure | Richard A. Conti, Jessica Dechene, Susan S. Fan, Jeffrey C. Shearer | 2018-01-02 |