Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10108753 | Laminate substrate thermal warpage prediction for designing a laminate substrate | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2018-10-23 |
| 10096557 | Tiled-stress-alleviating pad structure | Ekta Misra, Mukta G. Farooq | 2018-10-09 |
| 10090271 | Metal pad modification | Ekta Misra | 2018-10-02 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9865557 | Reduction of solder interconnect stress | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2018-01-09 |