| 10068864 |
Nanowires for pillar interconnects |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2018-09-04 |
| 10049897 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2018-08-14 |
| 9953940 |
Corrosion resistant aluminum bond pad structure |
Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter |
2018-04-24 |
| 9947598 |
Determining crackstop strength of integrated circuit assembly at the wafer level |
Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander +1 more |
2018-04-17 |
| 9933577 |
Photonics chip |
Jeffery P. GAMBINO, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy |
2018-04-03 |
| 9911708 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2018-03-06 |
| 9911711 |
Structures and methods to enable a full intermetallic interconnect |
Charles L. Arvin, Wolfgang Sauter |
2018-03-06 |
