Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049897 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2018-08-14 |
| 9997385 | Centering substrates on a chuck | Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more | 2018-06-12 |
| 9891261 | Electromigration monitor | Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more | 2018-02-13 |