Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103119 | Methods of forming integrated circuit structure for joining wafers and resulting structure | Tanya A. Atanasova | 2018-10-16 |
| 10096557 | Tiled-stress-alleviating pad structure | Ekta Misra, Krishna R. Tunga | 2018-10-09 |
| 10079175 | Insulating a via in a semiconductor substrate | Jennifer A. Oakley, Kevin S. Petrarca, Nicole R. Reardon, Andrew H. Simon | 2018-09-18 |
| 10068899 | IC structure on two sides of substrate and method of forming | Ian D. Melville | 2018-09-04 |
| 10049979 | IC structure including TSV having metal resistant to high temperatures and method of forming same | Ian D. Melville | 2018-08-14 |
| 10037911 | Device layer transfer with a preserved handle wafer section | Anthony K. Stamper, John A. Fitzsimmons, Mark D. Jaffe, Randy L. Wolf | 2018-07-31 |
| 9966310 | Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same | John A. Fitzsimmons, Anthony K. Stamper | 2018-05-08 |
| 9929085 | Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same | John A. Fitzsimmons, Anthony K. Stamper | 2018-03-27 |
| 9891261 | Electromigration monitor | Fen Chen, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more | 2018-02-13 |
| 9892970 | Integrated circuit structure having deep trench capacitor and through-silicon via and method of forming same | John A. Fitzsimmons, Anthony K. Stamper | 2018-02-13 |