Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068899 | IC structure on two sides of substrate and method of forming | Mukta G. Farooq | 2018-09-04 |
| 10049979 | IC structure including TSV having metal resistant to high temperatures and method of forming same | Mukta G. Farooq | 2018-08-14 |
| 9947645 | Multi-project wafer with IP protection by reticle mask pattern modification | Soon Yoeng Tan, Teck Jung Tang, Yelei Vianna Yao, Yasushi Yamagata | 2018-04-17 |