Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049897 | Extrusion-resistant solder interconnect structures and methods of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2018-08-14 |
| 9899279 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2018-02-20 |