Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Steven P. Ostrander, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds | 2018-02-20 |