Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984988 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2018-05-29 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2018-02-20 |