Issued Patents 2018
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156019 | Electrodeposition system and method incorporating an anode having a back side capacitive element | Jürg Stahl | 2018-12-18 |
| 10138568 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2018-11-27 |
| 10087546 | Prevent and remove organics from reservoir wells | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2018-10-02 |
| 10068864 | Nanowires for pillar interconnects | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2018-09-04 |
| 10053794 | Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2018-08-21 |
| 10041183 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Harry D. Cox, Eric D. Perfecto | 2018-08-07 |
| 10043723 | Method of forming a temporary test structure for device fabrication | Brian M. Erwin, Gary W. Maier | 2018-08-07 |
| 10030315 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2018-07-24 |
| 9997424 | Method of forming a temporary test structure for device fabrication | Brian M. Erwin, Gary W. Maier | 2018-06-12 |
| 9961765 | Security mesh and method of making | Brian M. Erwin | 2018-05-01 |
| 9953940 | Corrosion resistant aluminum bond pad structure | Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2018-04-24 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Brian R. Sundlof, Steven P. Ostrander, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9933577 | Photonics chip | Jeffery P. GAMBINO, Wolfgang Sauter, Christopher D. Muzzy, Robert K. Leidy | 2018-04-03 |
| 9911708 | Conductive pillar shaped for solder confinement | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2018-03-06 |
| 9911711 | Structures and methods to enable a full intermetallic interconnect | Christopher D. Muzzy, Wolfgang Sauter | 2018-03-06 |
| 9899280 | Method of forming a temporary test structure for device fabrication | Brian M. Erwin, Gary W. Maier | 2018-02-20 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2018-02-20 |
| 9863051 | Electrodeposition system and method incorporating an anode having a back side capacitive element | Jürg Stahl | 2018-01-09 |