Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163673 | Dual adhesive bonding with perforated wafer | Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Anthony K. Stamper | 2018-12-25 |
| 10090180 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2018-10-02 |
| 9953940 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2018-04-24 |