Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10108753 | Laminate substrate thermal warpage prediction for designing a laminate substrate | Anson J. Call, Vijayeshwar D. Khanna, Krishna R. Tunga | 2018-10-23 |
| 10080283 | Interface for limiting substrate damage due to discrete failure | Bruce J. Chamberlin, Scott B. King, Joseph Kuczynski | 2018-09-18 |
| 9990707 | Image analysis methods for plated through hole reliability | Sarah K. Czaplewski, Scott B. King, Joseph Kuczynski | 2018-06-05 |
| 9913405 | Glass interposer with embedded thermoelectric devices | Jeffrey P. Gambino, Richard S. Graf, Sudeep Mandal | 2018-03-06 |
| 9865557 | Reduction of solder interconnect stress | Anson J. Call, Vijayeshwar D. Khanna, Krishna R. Tunga | 2018-01-09 |