Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10108753 | Laminate substrate thermal warpage prediction for designing a laminate substrate | Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga | 2018-10-23 |
| 9865557 | Reduction of solder interconnect stress | Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga | 2018-01-09 |