| 10163777 |
Interconnects for semiconductor packages |
Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go +1 more |
2018-12-25 |
| 10153253 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus |
Howe Yin Loo, Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong |
2018-12-11 |
| 10083922 |
Inductor interconnect |
Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong +1 more |
2018-09-25 |
| 10085342 |
Microelectronic device having an air core inductor |
Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Chin Lee Kuan, Howe Yin Loo |
2018-09-25 |
| 10041282 |
Micro-hinge for an electronic device |
Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh |
2018-08-07 |
| 10036187 |
Micro-hinge for an electronic device |
Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh |
2018-07-31 |
| 9972589 |
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer |
Eng Huat Goh, Jiun Hann Sir, Seok Ling Lim, Hoay Tien Teoh |
2018-05-15 |
| 9960224 |
Three capacitor stack and associated methods |
Eng Huat Goh, Jiun Hann Sir, Han Kung Chua, Hoay Tien Teoh |
2018-05-01 |