Min Suet Lim — 8 Patents at Intel

Issued Patents 2018

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10163777	Interconnects for semiconductor packages	Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go +1 more	2018-12-25
10153253	Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus	Howe Yin Loo, Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong	2018-12-11	$24,515,000
10083922	Inductor interconnect	Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong +1 more	2018-09-25	$26,257,000
10085342	Microelectronic device having an air core inductor	Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Chin Lee Kuan, Howe Yin Loo	2018-09-25	$26,257,000
10041282	Micro-hinge for an electronic device	Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh	2018-08-07	$25,284,000
10036187	Micro-hinge for an electronic device	Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh	2018-07-31	$36,087,000
9972589	Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer	Eng Huat Goh, Jiun Hann Sir, Seok Ling Lim, Hoay Tien Teoh	2018-05-15	$21,346,000
9960224	Three capacitor stack and associated methods	Eng Huat Goh, Jiun Hann Sir, Han Kung Chua, Hoay Tien Teoh	2018-05-01	$34,156,000