Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong | 2018-12-11 |
| 10136516 | Microelectronic device attachment on a reverse microelectronic package | Choong Kooi Chee | 2018-11-20 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah +1 more | 2018-09-25 |
| 10085342 | Microelectronic device having an air core inductor | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan | 2018-09-25 |
| 10041282 | Micro-hinge for an electronic device | Bok Eng Cheah, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-08-07 |
| 10036187 | Micro-hinge for an electronic device | Bok Eng Cheah, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-07-31 |
| 9904321 | Wearable electronic devices and components thereof | Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew +1 more | 2018-02-27 |