| 10153253 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus |
Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong |
2018-12-11 |
| 10136516 |
Microelectronic device attachment on a reverse microelectronic package |
Choong Kooi Chee |
2018-11-20 |
| 10083922 |
Inductor interconnect |
Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah +1 more |
2018-09-25 |
| 10085342 |
Microelectronic device having an air core inductor |
Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan |
2018-09-25 |
| 10041282 |
Micro-hinge for an electronic device |
Bok Eng Cheah, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh |
2018-08-07 |
| 10036187 |
Micro-hinge for an electronic device |
Bok Eng Cheah, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh |
2018-07-31 |
| 9904321 |
Wearable electronic devices and components thereof |
Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew +1 more |
2018-02-27 |