| 10158339 |
Capacitive compensation structures using partially meshed ground planes |
Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Wil Choon Song |
2018-12-18 |
| 10153253 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus |
Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Jackson Chung Peng Kong, Khang Choong Yong |
2018-12-11 |
| 10083922 |
Inductor interconnect |
Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Jackson Chung Peng Kong +1 more |
2018-09-25 |
| 10085342 |
Microelectronic device having an air core inductor |
Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo |
2018-09-25 |
| 10079158 |
Vertical trench routing in a substrate |
Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Kuan-Yu Chen |
2018-09-18 |
| 10041282 |
Micro-hinge for an electronic device |
Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh |
2018-08-07 |
| 10036187 |
Micro-hinge for an electronic device |
Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh |
2018-07-31 |
| 10014710 |
Foldable fabric-based packaging solution |
Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Teong Guan Yew, Eng Huat Goh |
2018-07-03 |
| 9893444 |
Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices |
Jackson Chung Peng Kong, Eng Huat Goh, Su Sin Florence Phun, Khang Choong Yong, Min Keen Tang |
2018-02-13 |