Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10158339 | Capacitive compensation structures using partially meshed ground planes | Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Wil Choon Song | 2018-12-18 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Jackson Chung Peng Kong, Khang Choong Yong | 2018-12-11 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10085342 | Microelectronic device having an air core inductor | Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo | 2018-09-25 |
| 10079158 | Vertical trench routing in a substrate | Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Kuan-Yu Chen | 2018-09-18 |
| 10041282 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-08-07 |
| 10036187 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-07-31 |
| 10014710 | Foldable fabric-based packaging solution | Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Teong Guan Yew, Eng Huat Goh | 2018-07-03 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Eng Huat Goh, Su Sin Florence Phun, Khang Choong Yong, Min Keen Tang | 2018-02-13 |