| 10163777 |
Interconnects for semiconductor packages |
Seok Ling Lim, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more |
2018-12-25 |
| 10153253 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus |
Howe Yin Loo, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong |
2018-12-11 |
| 10083922 |
Inductor interconnect |
Min Suet Lim, Chin Lee Kuan, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong +1 more |
2018-09-25 |
| 10014710 |
Foldable fabric-based packaging solution |
Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Teong Guan Yew |
2018-07-03 |
| 9972589 |
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer |
Min Suet Lim, Jiun Hann Sir, Seok Ling Lim, Hoay Tien Teoh |
2018-05-15 |
| 9960224 |
Three capacitor stack and associated methods |
Jiun Hann Sir, Han Kung Chua, Min Suet Lim, Hoay Tien Teoh |
2018-05-01 |
| 9907170 |
FPC connector for better signal integrity and design compaction |
Hoay Tien Teoh |
2018-02-27 |
| 9893444 |
Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices |
Jackson Chung Peng Kong, Bok Eng Cheah, Su Sin Florence Phun, Khang Choong Yong, Min Keen Tang |
2018-02-13 |