Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more | 2018-12-25 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Seok Ling Lim | 2018-05-15 |
| 9960224 | Three capacitor stack and associated methods | Eng Huat Goh, Jiun Hann Sir, Han Kung Chua, Min Suet Lim | 2018-05-01 |
| 9907170 | FPC connector for better signal integrity and design compaction | Eng Huat Goh | 2018-02-27 |