Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jiun Hann Sir +1 more | 2018-12-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jiun Hann Sir +1 more | 2018-12-25 |