Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10158339 | Capacitive compensation structures using partially meshed ground planes | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Wil Choon Song | 2018-12-18 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2018-12-11 |
| 10108227 | Techniques for providing an interface component for a wearable device | Shu Young Cheah, Wil Choon Song, Jackson Chung Peng Kong, Howard L. Heck | 2018-10-23 |
| 10085342 | Microelectronic device having an air core inductor | Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo | 2018-09-25 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10079158 | Vertical trench routing in a substrate | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Kuan-Yu Chen | 2018-09-18 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Eng Huat Goh, Bok Eng Cheah, Su Sin Florence Phun, Min Keen Tang | 2018-02-13 |