Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10136516 | Microelectronic device attachment on a reverse microelectronic package | Howe Yin Loo | 2018-11-20 |
| 9978735 | Interconnection of an embedded die | Loke Yip Foo, Mei See Chin, Wai Ling Lee, Wei Lun Oo | 2018-05-22 |