Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825144 | Semiconductor device having metal gate structure | Shih-Fang Tzou, Chien-Ming Lai, Yi-Wen Chen, Hung-Yi Wu, Tong-Jyun Huang +1 more | 2017-11-21 |
| 9811000 | Photolithography tool and method thereof | Chia-Feng Liao, Pei-Yi Su, Yi-Ming Dai, Chung-Hsing Lee, Chien-Ko Liao +4 more | 2017-11-07 |
| 9793382 | Manufacturing method of semiconductor device | Chia-Lin Lu, Chun-Lung Chen, Kun-Yuan Liao, Feng-Yi Chang | 2017-10-17 |
| 9793170 | Semiconductor device and fabrication method thereof | Chia-Chang Hsu | 2017-10-17 |
| 9768029 | Method of forming a semiconductor structure | Min Chen | 2017-09-19 |
| 9748233 | Semiconductor device and method for fabricating the same | Chia-Chang Hsu | 2017-08-29 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-07-25 |
| 9698030 | Temperature controlled loadlock chamber | Jyh-Cherng Sheu, Ming-Feng Yoo, Kewei Zuo | 2017-07-04 |
| 9685337 | Method for fabricating semiconductor device | Ching-Wen Hung, Jia-Rong Wu, Yi-Hui Lee, Ying-Cheng Liu, Chih-Sen Huang | 2017-06-20 |
| 9666715 | FinFET transistor with epitaxial structures | Chung-Fu Chang, Chen-Yi Weng | 2017-05-30 |
| 9640484 | Semiconductor device and manufacturing method thereof | Chia-Lin Lu, Chun-Lung Chen, Kun-Yuan Liao, Feng-Yi Chang | 2017-05-02 |
| 9640503 | Package substrate, semiconductor package and method of manufacturing the same | Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Yu-Cheng Pai | 2017-05-02 |