Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Ming-Chen Sun, Tzu-Chieh Shen +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9564390 | Package structure and fabrication method thereof | — | 2017-02-07 |