Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9666302 | System and method for memory scan design-for-test | Ming-Hung Chang, Ching-Wei Wu | 2017-05-30 |
| 9564346 | Package carrier, semiconductor package, and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang | 2017-02-07 |