Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659853 | Double side via last method for double embedded patterned substrate | You-Lung Yen, Chih-Cheng Lee | 2017-05-23 |
| 9583427 | Semiconductor substrate, semiconductor package structure and method of making the same | Chih-Cheng Lee, Cheng-Lin Ho, Chung-Ming Wu, You-Lung Yen | 2017-02-28 |
| 9564346 | Package carrier, semiconductor package, and process for fabricating same | Shih-Fu Huang, Chia-Cheng Chen | 2017-02-07 |