Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659853 | Double side via last method for double embedded patterned substrate | Chih-Cheng Lee, Yuan-Chang Su | 2017-05-23 |
| 9583427 | Semiconductor substrate, semiconductor package structure and method of making the same | Chih-Cheng Lee, Yuan-Chang Su, Cheng-Lin Ho, Chung-Ming Wu | 2017-02-28 |