| 9735080 |
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same |
Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more |
2017-08-15 |
| 9716060 |
Package structure with an embedded electronic component and method of fabricating the package structure |
Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more |
2017-07-25 |
| 9673140 |
Package structure having a laminated release layer and method for fabricating the same |
Chia-Cheng Chen, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao, Yu-Cheng Pai +1 more |
2017-06-06 |
| 9640503 |
Package substrate, semiconductor package and method of manufacturing the same |
Chun-Hsien Lin, Tzu-Chieh Shen, Shih-Chao Chiu, Yu-Cheng Pai |
2017-05-02 |